High-Speed M6 & IS370HR 6-Layer PCB with Thermal Coin for RF Applications
1.Introduction
This advanced 6-layer PCB integrates M6 high-speed material (Dk 3.34@13GHz) and IS370HR high-Tg FR-4 in a hybrid stackup, featuring an embedded copper coin for enhanced thermal dissipation. Designed for high-frequency applications, it supports:
5G mmWave antennas and RF front-ends
77GHz automotive radar (ADAS)
Aerospace/defense systems
The hybrid design balances signal integrity (M6’s low-loss properties) with thermal reliability (IS370HR’s 180°C Tg), while the copper coin optimizes heat transfer in power-dense areas.
2.Key Performance Features
M6 Material:
Dk 3.34 @13GHz, Df 0.0037 @13GHz
CTE 16/16/45 ppm/°C (X/Y/Z)
Tg >185°C (DSC), Td 410°C
UL 94V-0, RoHS compliant
IS370HR FR-4:
Tg 180°C, Td 340°C
Low CTE (13/14 ppm/°C X/Y)
CAF resistant, UV-blocking
Shared Advantages:
ENIG finish (20μm plating)
Resin-filled vias for reliability
4/4 mil trace/space precision
3.PCB Specifications at a Glance
| Specification | Details |
|---|---|
| Base Material | M6 High Speed + IS370HR High-Tg FR-4 |
| Layer Count | 6 layers |
| Board Dimensions | 120mm × 60mm (±0.15mm) |
| Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.2mm |
| Via Technology | Through-hole only (No blind vias) |
| Board Thickness | 1.0mm |
| Copper Weight (Outer) | 1oz (1.4 mils) |
| Via Plating | 20μm (resin filled & capped) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Silkscreen | White (Top/Bottom) |
| Solder Mask | Green (Top/Bottom) |
| Thermal Feature | Embedded copper coin (center) |
| Quality Assurance | 100% electrical tested |
4.PCB Stackup: 6-layer rigid PCB
| Layer | Type | Thickness | Material | Copper Weight | Dk Value |
|---|---|---|---|---|---|
| 1 | Top Layer | 35 μm | - | 1oz | - |
| - | Core | 0.25 mm | R5775G (M6) | - | 3.61 |
| 2 | Inner Layer | 18 μm | - | 0.5oz | - |
| - | Prepreg | 0.14 mm | IS370HR-1080 (64%) x2 | - | 3.72 |
| 3 | Inner Layer | 35 μm | - | 1oz | - |
| - | Core | 0.1 mm | IS370HR | - | 4.17 |
| 4 | Inner Layer | 35 μm | - | 1oz | - |
| - | Prepreg | 0.14 mm | IS370HR-1080 (64%) x2 | - | 3.72 |
| 5 | Inner Layer | 18 μm | - | 0.5oz | - |
| - | Core | 0.1 mm | IS370HR | - | 4.17 |
| 6 | Bottom Layer | 35 μm | - | 1oz | - |
5.PCB Statistics:
Components: 67
Total Pads: 250
Thru Hole Pads: 198
Top SMT Pads: 36
Bottom SMT Pads: 16
Vias: 91
Nets: 23
6.Typical Applications
5G Infrastructure: AAU RF front-ends
Automotive: 77GHz radar, ADAS
Aerospace: Avionics, guidance systems
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support